Trial Purpose:
To evaluate selected products for buffing compound removal.
Date Run:
08/04/2005Experiment Procedure:
Nine products were selected from the lab's database of test results based on supplied information from the client. Each product was used at full strength at room temperature. A 250 ml beaker was filled with each product and placed on a stir plate.
Twenty-seven preweighed 260 Brass coupons were coated with the Mocha buffing compound. The compound was applied by heating the coupons and the buffing compound with a Master Appliance Heat Gun. The hot buffing compound was rubbed across the surface. Coupons were allowed to cool to room temperature and weighed a second time to determine the amount of contaminant applied. Three coupons were cleaned in each product for 5 minutes using stir-bar agitation. After cleaning, the parts were allowed to air dry for 10 minutes at room temperature. Once dry, final weights were recorded and efficiencies were calculated for each product.
Trial Results:
Several of the products were found to remove over 60% of the buffing compound while cleaning at room temperature. A couple of products removed about half of the buffing compound and a couple more removed about a third. Only two products had little success removing the buffing compound. The table below lists the amount of buffing compound applied, the amount remaining and the efficiency for each coupon cleaned.
| Cleaner | Initial wt | Final wt | % Removed |
| AK 225 | 0.1535 | 0.0854 | 44.36 |
| 0.1898 | 0.1431 | 24.60 | |
| 0.2192 | 0.1247 | 43.11 | |
| Ensolv | 0.2621 | 0.1601 | 38.92 |
| 0.1724 | 0.1033 | 40.08 | |
| 0.2993 | 0.1187 | 60.34 | |
| CCA | 0.2908 | 0.0666 | 77.10 |
| 0.2646 | 0.0879 | 66.78 | |
| 0.2099 | 0.1300 | 38.07 | |
| MCA | 0.2015 | 0.1084 | 46.20 |
| 0.2607 | 0.1737 | 33.37 | |
| 0.2321 | 0.1606 | 30.81 | |
| Lenium CP | 0.2009 | 0.1650 | 17.87 |
| 0.3606 | 0.3219 | 10.73 | |
| 0.2959 | 0.2606 | 11.93 | |
| Lenium ES | 0.3102 | 0.0800 | 74.21 |
| 0.3855 | 0.1383 | 64.12 | |
| 0.1317 | 0.0601 | 54.37 | |
| Solvon IP | 0.1674 | 0.0757 | 54.78 |
| 0.3607 | 0.1225 | 66.04 | |
| 0.2899 | 0.0873 | 69.89 | |
| Solvon PB | 0.2702 | 0.0563 | 79.16 |
| 0.1220 | 0.0829 | 32.05 | |
| 0.0919 | 0.0580 | 36.89 | |
| HFE 7100 | 0.1499 | 0.1360 | 9.27 |
| 0.0798 | 0.0862 | -8.02 | |
| 0.1928 | 0.2286 | -18.57 |
Success Rating:
Results successful using TACT (time, agitation, concentration, and temperature, as well as rinsing and drying) and/or other cleaning chemistries examined.Conclusion:
Seven of the nine product will be used on the second supplied buffing compound under the same conditions.
