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Electronics
Project Number 1
Summary:
Two possible cleaning methods were identified. The first was using laser ablation and the second utilized an alkaline based cleaner and ultrasonics. The ultrasonic cleaning took longer to clean the parts but worked better than the laser ablation. Follow up testing may include baking parts at elevated temperatures before cleaning with the ultrasonics.Test Objective:
To identify new cleaning process for alumina based ceramic components used in semiconductor industryProduct Use:
Part of manufacturing equipment| Trial Number | Date Run | Purpose | Success Rating |
|---|---|---|---|
| 0 | 09/19/2008 | To screen potential alternative cleaning products | Preliminary compatibility tests on substrate coupons encouraging for at least one cleaning chemistry. More in-depth laboratory testing necessary. |
| 1 | 10/02/2008 | To further evaluate baking soda blasting for removing oxides and carbon deposits from ceramic part. | A follow up test, usually based on company input. |
| 2 | 10/02/2008 | To evaluate laser ablation cleaning technology for removal of carbon deposits and oxides from ceramic parts. | Results suggest a scale-up feasible match for cleaning chemistry and equipment. Pilot plant study with actual parts recommended. |
| 3 | 12/09/2008 | To evaluate ultrasonic cleaning on supplied ceramic parts | Results suggest a scale-up feasible match for cleaning chemistry and equipment. Pilot plant study with actual parts recommended. |