Project #2 / K & M Electronics / Clients / Media

Name

Project #2

Test Objective

Determine how clean is clean

Witnessed

No

Confidential

No

Help Implementing

No

Submission Date

10/05/1999

Representatives

Steve Berg

Substrates

Ceramics
Plastic

Sample Type

printed circuit boards

Product Use

Power supplies

Percentages Cleaned

60% Plastic, 20% metal (solder), 20% ceramic

Weight Min

10 g

Weight Max

28 g

Approximate Size

1 x4 inches

Approximate Size ID

Small

Weight Range ID

Less than 1 lb

Shape

Rough

Hardness

Hard

Shape Type

Simple

Return Samples

Yes

Return Sample Address

Contaminants

Fluxes
Rust/Scale

Samples Available

No

Pre Clean Manufacturing Step

solder/ assembly

Post Clean Manufacturing Step

encapsulation

Parts Cleaned Per Week

200/day

Parts Cleaned Per Bath

Frequency

PSI

Equipments

Immersion/Soak
Ultrasonics

Vendor

UFI (ultrasonics)

Cleaning Chemicals

Armakleen

Concentration

6-8

Cleaning Temp

150

Cleaning Time

3-6

Cleaning Water Type

DI

Problems With Current Method

Ineffective, leaves residue

Purpose of Cleaning

To promote potting adhesion and remove electronically conductive materials

Rinse Time

10

Rinse Temp

120

Rinse Water Type

DI

Drying Method

Air dry

Drying Time

15-30

Drying Temp

70-90

Storage Type ID

Used Immediately

How Stored

How Long Stored

Analysis Method

Visual

Performance Test

no criteria

Comments or Concerns

Organic, inorganic, ionic contamination measured desired

Summary

Attempted to measure contamination using different analytical methods.

Implementation

No

In Progress

No

Technolog Transfer

No

Analysis Only

Yes

Part Picture

Yes

Default object view. Click to create a custom template, Node ID: 4220, Object ID: 4219

Project #2