Project #3 / K & M Electronics / Clients / Media

Name

Project #3

Test Objective

To remove surface flux from circuit boards, to remove flux from transformers and to remove epoxy resin from plastic surface.

Witnessed

Yes

Confidential

No

Help Implementing

No

Submission Date

03/16/2001

Representatives

Phil Utter

Substrates

Copper
Plastic
Teflon

Sample Type

Product Use

Percentages Cleaned

Weight Min

Weight Max

Approximate Size

Approximate Size ID

Weight Range ID

Shape

Rough

Hardness

Hard

Shape Type

Complex

Return Samples

Yes

Return Sample Address

Contaminants

Fluxes

Samples Available

Yes

Pre Clean Manufacturing Step

soldering

Post Clean Manufacturing Step

priming, forging and casing

Parts Cleaned Per Week

50

Parts Cleaned Per Bath

Frequency

PSI

Equipments

Immersion/Soak

Vendor

Cleaning Chemicals

Ensolv, Dynasolv

Concentration

Cleaning Temp

room

Cleaning Time

4

Cleaning Water Type

Tap

Problems With Current Method

want to eliminate ensolv and dynsolv due to health issues.

Purpose of Cleaning

remove flux

Rinse Time

2

Rinse Temp

room

Rinse Water Type

Tap

Drying Method

Oven-Convection

Drying Time

60

Drying Temp

95

Storage Type ID

Used Immediately

How Stored

How Long Stored

Analysis Method

Visual, microscopic

Performance Test

electrostatic test (omega meter)

Comments or Concerns

Kyzen Ionox HC 2 compatibility with components.

Summary

Projected successfully evaluated the use of Kyzen Ionox HC2 for the removal of surface flux from circuit boards.

Implementation

Yes

In Progress

No

Technolog Transfer

No

Analysis Only

No

Part Picture

Yes

Name	Class	Section
Trial #0	Trial	3
Trial #1	Trial	3
Trial #2	Trial	3

Default object view. Click to create a custom template, Node ID: 4221, Object ID: 4220

Project #3