Project #1
To identify new cleaning process for alumina based ceramic components used in semiconductor industry
09/15/2008
Part of manufacturing equipment
18" diamter ring
Medium
Manufacturing of semiconductors
Same
Doesn't result in needed cleanliness levels
Remove deposits and oxides from equipment prior to being reused.
No relation
No relation
Cleaning performed by outside company.
Two possible cleaning methods were identified. The first was using laser ablation and the second utilized an alkaline based cleaner and ultrasonics. The ultrasonic cleaning took longer to clean the parts but worked better than the laser ablation. Follow up testing may include baking parts at elevated temperatures before cleaning with the ultrasonics.