Project #1 / Material Solutions / Clients / Media

Name

Project #1

Test Objective

Develop contamination removal process that uses minimal water.

Witnessed

Yes

Confidential

Yes

Help Implementing

No

Submission Date

06/17/1999

Representatives

Dave Kellerman

Substrates

Ceramics
Alumina

Sample Type

Product Use

Microelectronic substrates: metallized using either thin or flick technologies.

Percentages Cleaned

Weight Min

Weight Max

Approximate Size

1x1x0.25 inches up to 4.5 inches square

Approximate Size ID

Small

Weight Range ID

Less than 1 lb

Shape

Smooth

Hardness

Hard

Shape Type

Simple

Return Samples

No

Return Sample Address

Contaminants

Alcohol

Samples Available

Yes

Pre Clean Manufacturing Step

Laser scribe-slag scrape-clean

Post Clean Manufacturing Step

dry-QC-pack and ship

Parts Cleaned Per Week

4-18 racks/load

Parts Cleaned Per Bath

20/rack

Frequency

40

PSI

Equipments

Low Pressure Spray
Ultrasonics

Vendor

Ney (US), Hobart (SW)

Cleaning Chemicals

Micro 90

Concentration

2

Cleaning Temp

155

Cleaning Time

Cleaning Water Type

DI

Problems With Current Method

Dishwasher: some soap splash on the parts after rinse

Purpose of Cleaning

Remove PVA and laser slag

Rinse Time

4 rinses

Rinse Temp

140

Rinse Water Type

DI

Drying Method

Oven-Convection

Drying Time

15

Drying Temp

212

Storage Type ID

Stored

How Stored

How Long Stored

Analysis Method

Visual, microscopic

Performance Test

Comments or Concerns

Summary

Ran search using vendor supplied information and data from All Tests database.

Implementation

Yes

In Progress

No

Technolog Transfer

Yes

Analysis Only

No

Part Picture

Yes

Name	Class	Section
Trial #15	Trial	3
Trial #16	Trial	3
Trial #17	Trial	3
Trial #18	Trial	3
Trial #19	Trial	3
Trial #20	Trial	3
Trial #21	Trial	3
Trial #22	Trial	3

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Project #1