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Trial Number 0

Trial Purpose:

To evaluate cleaners for their effectiveness in removing lead and lead free solder on electronic parts with low odor.

Date Run:

07/28/2011

Experiment Procedure:

Six cleaning products were chosen from the labs database, www.cleanersolutions.org to be used in the trial. Six parts were chosen from those supplied by the client to be cleaned by room temperature ultrasonics. Each part was cleaned in the smallest Branson unit that could handle each part. The parts were cleaned for 10 minutes and then rinses in tap water at the sink and dried by compressed air blow off. Both rinse and drying were done for approximately 30 seconds. The parts were then bagged for transport back to the client.

Trial Results:

Parts will be sent back to the client to determine which cleaners worked if any.

Mfr Product Observations
MAS Products Bio Solv Solder joints have corroded, dull look, no odor
Buckeye Int  Shopmaster RC Residue on board, joints look better. No odor
Gentek  SC Soyester Nasty residual odor, lots of flux left
AG Environ. Prod   Soygold 2000 Nasty odor. Residue on board, not fully cleaned
Bio Chem Systems Solsafe 245 Better, one component on borad not clean. Joints lost shine
Gemtek EZ Solv Not too bad. Joints lost some shine

Success Rating:

Results successful using TACT (time, agitation, concentration, and temperature, as well as rinsing and drying) and/or other cleaning chemistries examined.

Conclusion:

Parts are being sent back for the client to check for cleanliness in their facility. They will notify the lab which products cleaned then we will screen the cleaners that were effective for performance for odor and test those cleaners at the facility to see how the worker effected by the cleaner smell feels.

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