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To evaluate selected cleaners for the removal of the solder flux.
Five cleaners were selected from the previous trial. Three solutions were diluted with DI water to five percent by volume in a 600 ml beaker. The other two products were diluted to 10% as suggested by the vendor. All eight solutions were heated to 130 F on a hot plate.
Fifteen preweighed coupons were coated with the supplied flux and weighed again. Three coupons were cleaned in a solution for five minutes at room temperature using stir-bar agitation. After cleaning the coupons were rinsed for 15 second in tap water at 120 F and dried using a Master Appliance Corp, Hot-air gun model HG-301A at 500 F for one minute. Following the drying, final clean weights were recorded and efficiencies were calculated.
SUBSTRATE MATERIAL: Circuit Board coupons
CONTAMINANTS: Flux-Kester Solder 1544 Rosin Solder flux (CAS#s: 64-17-5, 78-92-2, 8050-09-7)
CONTAMINATING PROCESS USED: Coupons were coated with oil using a hand held swab.
Only SWR Corp and Envirosolutions were effective in removing over 85% of the flux from the coupons. Valtech removed just over 75% with the other two cleaners cleaning less than 35%. Table 2 lists the calculated contaminant removal rates for each cleaner tested.
Table 2. Cleaning Efficiencies
As noted in the table, when Envirosolutions Bio-T Max was heated at the 10% dilution, a white particulate matter was formed. Rinsing this white material off the coupons was some what difficult and a second tap water spray was used for 20 seconds.
Success Rating:Results successful using TACT (time, agitation, concentration, and temperature, as well as rinsing and drying) and/or other cleaning chemistries examined.
SWR Corp SWR One and Envirosolutions Bio-T Max were both moderately successful in removing the flux from the circuit board coupons. A follow test will be conducted to evaluate SWR Corp and Valtech at higher concentrations (10%) and Bio-T Max at room temperature.