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To evaluate selected products for replacing TCE for removing buffing compound.
Eight alternative products were selected from the lab's database of testing results based on supplied client information. Products were selected based on buffing compound and oil removal potential and compatibility with copper and brass metal substrates. Each product was diluted to 5% in 250 ml beakers using DI water and heated to 130 F on a hot plate.
Twenty-four preweighed coupons were coated with the red buffing compound using a hand held swab after heating to its melting point with a heat gun. Coupons were weighed a second time to determine the amount of buffing compound added. Three coupons were cleaned in each solution for five minutes using minimal stir bar agitation. Coupons were rinsed for 15 seconds in a tap water bath at 120 F and dried using a dry compressed air for 30 seconds. Once dry coupons were weighed a final time and product efficiencies were calculated.
Three products removed over 60% of the buffing compound from the copper coupons after five minutes of immersion cleaning. The following table lists the amount of buffing compound applied, the amount remaining and the efficiency for each coupon cleaned.
|Cleaner||Initial wt||Final wt||% Removed|
|Polyspray Jet 790 XS||0.6940||0.2108||69.63|
|Crystal Simple Green||0.9235||0.8357||9.51|
Success Rating:Results successful using TACT (time, agitation, concentration, and temperature, as well as rinsing and drying) and/or other cleaning chemistries examined.
The three effective products will be retested using ultrasonics and a higher temperature in an effort to increase the efficiencies of the products.